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美***Royce全自動型芯片拾取系統MP300 

適用于2-12英寸晶圓
• *小200微米芯片拾取
• *適合高、中產能，產能可達2000UPH
• 可選配芯片轉向功能
• 可輸出至2”及4” Tray盤，Wafers, Gel-Pak®, Waffle Pack, 或訂制
   Tray
• 采用 Windows XP® 的 DieSort Manager 專業軟件
• 放置重復性 +/- 2 mil
• 拾取模式：常規真空表面接觸或非表面接觸(抓器)
• 10分鐘以內快速更換

非表面接觸拾取功能

Fully automatic MP300 chip pickup system

Suitable for 2-12 inch wafers

• minimum 200 micron chip pickup

• best for high ａnd medium capacity up to 2000UPH

• optional chip steering function

• export to 2 "and 4" trays, Wafers, gel-pak ®, Waffle Pack, or custom

Tray

• use Windows XP® DieSort Manager professional software

• place repeatability +/- 2 mil

• pickup mode: conventional vacuum surface contact or non-surface contact (gripper)

• quick replacement within 10 minutes

Non-surface contact pickup function